During epi deposition, process gases are combined with ________ gases to flow across the wafer surface to form the crystalline structure.
Dopant
Noble
Purge
Sputtering

Question

16-07-2024
Business

Answered

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During epi deposition, process gases are combined with ________ gases to flow across the wafer surface to form the crystalline structure.
Dopant
Noble
Purge
Sputtering

Sagot :

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During epi deposition, process gases are combined with ________ gases to flow across the wafer surface to form the crystalline structure. Dopant Noble Purge Sputtering

Sagot :

Other Questions

During epi deposition, process gases are combined with ________ gases to flow across the wafer surface to form the crystalline structure.
Dopant
Noble
Purge
Sputtering